Heater
Heater
- Main component of SEMI equipment for CVD, Etch process in semiconductor wafer manufacturing process.
- Core technology is to provide consistent heat across silicon wafer surface upon contact with heater.
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CVD
- CVD 1
- CVD 2
- CVD 3
CVD 1
CVD 1
Where to BuyWhere to BuyMain Material Aluminum Al 6061 Process CVD - Semi Operation Temp 120°C Uniformity ±1% Remarks Brazing type. Low Watt Heat Element. Cooling channel CVD 2
CVD 2
Where to BuyWhere to BuyMain Material Aluminum Al 6061 Process CVD - Semi Operation Temp 120°C Uniformity ±0.5% Remarks E-Beam Welding, Dual Zone, O-ring Sealing. Cooling. CVD 3
CVD 3
Where to BuyWhere to BuyMain Material Inconel 600 Process Solar Operation Temp 350°C Heater Size 40.89” * 40.89” Remarks Bare -
PVD
- PVD 1
- PVD 2
PVD 1
PVD 1
Where to BuyWhere to BuyMain Material SST Process PVD-Semi Operation Temp 350°C Size 12” Remarks Bare PVD 2
PVD 2
Where to BuyWhere to BuyMain Material SST Process PVD-Semi Operation Temp 250°C Size 8” Remarks Bare -
Ashing
- Ashing 1
- Ashing 2
Ashing 1
Ashing 1
Where to BuyWhere to BuyMain Material Aluminum A356 Process Ashing-Semi Operation Temp 250°C Size 12” Uniformity ±2°C Remarks Casting type. Wafer loading at ATM. Hard Anodizing. Ashing 2
Ashing 2
Where to BuyWhere to BuyMain Material Al6061-T6 Process Ashing-Semi Operation Temp 400°C Wafer Size 18” Remarks Hard Anodizing Ashing 3
Ashing 3
Where to BuyWhere to BuyMain Material Al1100 Process Ashing-Semi Operation Temp 350°C Heater Size 12” Remarks Bare -
Etching
- Etching 1
- Etching 2
Etching 1
Etching 1
Where to BuyWhere to BuyMain Material Aluminum Al 6061-T6 Process Etching Operation Temp 260°C Wafer Size 12” Remarks Hard Anodizing, Teflon Coating Etching 2
Etching 2
Where to BuyWhere to BuyMain Material Aluminum Al 6061-T6 Process Etching Operation Temp 260°C Wafer Size 12” Remarks Bare