History
2011 ~ present Hidden Champion in Component industry
- 2011. 03 Developed 'Magnetic Fluid Seal for LCD 8th Generation Robot'
- 2011. 05 Developed '200mm Ceramic Heater for CVD process'
- 2011. 08 Acquired certificate of SME component of KSM component technology innovation Small and Medium Business Administration
- 2012. 03 Developed '300mm Ceramic Heater for CVD process'
- 2012. 05 Developed 'Magnetic Fluid Seal for OLED'
- 2014. 05 Expanded 'Heater' and 'Sub Assembly' new plant (Haesung-myeon, Gimpo-si, Gyeonggi-do)
- 2014. 09 Patent acquisition for ceramic heaters and its manufacturing method
- 2014. 11 Patent acquisition of heat wire arrangement structure for ceramic heaters
- 2014. 11 Patent acquisition of method of manufacturing sintered bodies and method of manufacturing ceramic heaters including sintered bodies manufactured thereby
- 2014. 12 Patent acquisition for ceramic heater junctional structure
- 2015. 02 Patent acquisition for ceramic heater combination structure
- 2016. 10 Patent acquisition for ceramic heater combination structure
- 2017. 07 Patent acquisition of ESC, Electrostatic Chuck
- 2018. 04 Opened the new head quarter building
- 2018. 07 Patent acquisition of ceramic shower head and chemical vapor deposition apparatus
- 2018. 10 Development of Heater for next generation semiconductor equipment
- 2018. 11 Patent acquisition of ESC, Electrostatic Chuck and its manufacturing method
- 2018. 12 Received a Ten-Million-Dollar Export Monument Award from Ministry of Trade, Industry and Energy of Republic of Korea.
- 2019. 04 Dongtan branch relocation to Yeongcheon-dong, Hwaseong-si, Dongtan SK V1 Center
- 2019. 06 Patent acquisition of ceramic structure for plasma processing apparatus and its manufacturing method
- 2019. 09 Development of 'Multi Zone Ceramic Heater'
- 2021. 07 Obtained certification for ISO 14001 International Technology Quality Assurance
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2023.03
The Best Company of Sealing Component in Korea
Ministry of Trade, Industry and Energy -
2025.02
Obtained "Supplier Excellence"
certification from a global semiconductor company